John R. Severson, PE 

John Severson is ESDI's Founder, President and Principal Engineer.   He is a highly experienced and hands-on engineer and manager with a very strong track record of robust, trouble-free designs which smoothly pass EMC and other regulatory requirements. His excellent understanding of electronic, software, and mechanical design details is complemented by a creative and practical approach at the conceptual and marketing level. He is driven by making things work and taming the complicated. Mr. Severson's experience also includes:

• Founder and President of Ability Research, Inc. with a passion to bring innovative, affordable assistive technology to persons with profound disabilities. Some Ability Research firsts include a hands-free head-pointing computer keyboard, an innovative low cost point-to-speak communication aid, the first low cost dynamic screen communication aid, and a patented portable aid for special education and communication.
• Co-founder and Director of Engineering for Dimensional Medicine, Inc, an early innovator is 3D medical image processing. He defined the image processing hardware and software approach and helped build a team of more than a dozen engineers and programmers.
• Registered Professional Electrical Engineer (MN), Life Member, IEEE
• 30+ years experience in engineering, software, product development and project and company management.
• Inventor on multiple patents
• Recipient of MN Governor’s Award for technology-related assistance for persons with disabilities
• Former member of Courage Center Assistive Technology Advisory Board
• John R. Severson, PE on Linkedin      

ESDI is a product development and engineering company with over 25 years experience designing & managing development of products for security, imaging, industrial, assistive technology, and other markets. Technology includes high performance video and audio, custom LCD and CCD interface, RF, networking, extensive embedded software, battery power, high speed digital FPGAs, switching power supplies, mechanical packing, and plastic molding.